SEHLOMATHISO SA THEKNIKI: Pampiri e Tšoeu e Hlalosang ea Meralo ea Motheo ea Matla ea MIDA

Sehlomathiso sena se sebetsa e le motheo o felletseng oa tekheniki bakeng sa letoto la MIDA Power DC Fast Charging. Se fa li-CPO (Li-Charge Point Operators), batsamaisi ba likepe, le batseteli ba meralo ea motheo kutloisiso e tebileng ea lisebelisoa tsa hardware, software le meralo ea taolo e hlalosang lethathamo la lihlahisoa tsa MIDA tsa 2026.

I. Meralo ea Hardware: Fisiks ea Phetoho e Bokgoni bo Phahameng

Motheong oa seteishene se seng le se seng sa MIDA DC ho na le sethala sa phetoho ea motlakase se sebelisang theknoloji ea morao-rao ea semiconductor ea sebapali se seholo. Phetoho ea rona ho tloha ho Silicon (Si) ea setso ho ea ho Silicon Carbide (SiC) le Gallium Nitride (GaN) e bakile keketseho ea 3.5% ea katleho e phahameng (eo hona joale e fihlang ho 97.2%) le phokotso ea 40% ea litlhoko tsa ho qhala ha mocheso.

Litlhaloso tsa Hardware tsa Bohlokoa:

• Tokiso ea Mehato e 'Meli:Mokhahlelo o sebetsang oa PFC (Power Factor Correction) o netefatsa hore PF e feta 0.99 ha e jarisoa ka botlalo, e fokotsa ho sotha ha harmonic (THD).< 5%) khutlela ho gridi ea lisebelisoa.
• Khetho ea ho Pholisetsa Metsi:Mehlala e nang le sekgahla se phahameng (300kW+) e sebedisa sistimi ya phodise e kwalehileng e nang le mokelikeli wa dielectric o senyehang ke dimela, e boloka dikarolo tsa kahare di le maemong a matle a mocheso esita le dibakeng tse nang le tikoloho ya +50°C.
• Ho Leka-lekanya Moroalo o Matla:Li-DSP tse Kopaneng (Digital Signal Processors) li lumella seteishene ho arola matla pakeng tsa li-output tse peli ka keketseho ea 1kW, e leng se ntlafatsang phallo bakeng sa maemo a ho tjhaja likoloi tse ngata.

II. Bohlale ba Software: Tsamaiso ea Matla a Tsamaiswang ke AI

Sesebelisoa sa MIDA sa 2026 se tsamaisoa ke beng ba rona ba thepaGridSense™AI. Ho fapana le diprothokhole tsa ho tjhaja tse sa sebetseng, GridSense™ e buisana ka mafolofolo le BMS ya koloi (Sistimi ya Taolo ya Betri) le gridi ya tshebediso ya lehae ho bolela esale pele tlhokeho le ho laola meroalo e phahameng.

• Tlhokomelo e Lebelloang esale pele:Mefuta ea AI e sekaseka maqhubu a motlakase le li-RPM tsa fene ho bolela esale pele ho hloleha ha lisebelisoa ho fihlela matsatsi a 30 pele li etsahala, e leng se fokotsang nako ea ho se sebetse ha lisebelisoa ka 65%.
• Boitokisetso ba V2X:Liteishene tsohle tsa MIDA li se li loketse lisebelisoa tsa motlakase bakeng sa puisano ea Vehicle-to-Everything (V2X), e leng se lumellang li-EV ho sebetsa e le li-unit tsa polokelo ea matla a selefouno nakong ea liketsahalo tsa khatello ea grid.
• Ho latela Melao ea ISO 15118-20:Tšehetso e felletseng bakeng sa "Plug & Charge," e felisang tlhoko ea likarete tsa RFID kapa lisebelisoa tsa mehala ea thekeng bakeng sa netefatso.

III. Tšireletso le ho Latela Melao: Letlooa la Tšireletso

Nakong ena ea litšokelo tse ntseng li eketseha tsa inthanete ho meralo ea motheo ea bohlokoa, MIDA e kenya tšebetsong moralo oa ts'ireletso oa "Zero Trust". Pakete e 'ngoe le e 'ngoe ea data pakeng tsa seteishene le leru e patiloe ka mokhoa o patiloeng ho sebelisoa AES-256 'me e netefalitsoe ka li-chip tsa TPM (Trusted Platform Module) tse thehiloeng ho hardware.

Litifikeiti tsa Taolo:

• CE/TUV:E netefalitsoe bakeng sa maemo a polokeho a European Union le EMC.
• UL 2202/2231:Ho fihlela litlhoko tsa polokeho tsa Amerika Leboea bakeng sa lisebelisoa tsa ho tjhaja tsa DC.
• OCPP 2.0.1:Ho netefatsa hore ho ka sebelisana 'moho le marang-rang ohle a maholo a ho tjhaja lefatšeng ka bophara.

IV. Bopaki ba Bokamoso bakeng sa 2030 le ho Feta moo

Liteishene tsa MIDA li entsoe ka bophelo ba tšebeletso ea lilemo tse 15. Moralo oa modular o lumella li-module tsa motlakase tse ka ntlafatsoang tšimong, ho bolelang hore seteishene sa 120kW kajeno se ka ntlafatsoa ho ba 240kW nakong e tlang ka ho fapanyetsana likarolo tsa kahare feela, ho sireletsa matsete a pele a motse-moholo oa balekane ba rona.